News summary
[Tongcheng Xincai: The subsidiary signed a cooperation agreement on the "Advanced Polishing Pad Project for Semiconductor Chips"] Securities Times e Company Newsarabicroulette, Tongcheng Xincai (603650) announced on the evening of May 27 that its wholly-owned subsidiary Shanghai Tongcheng Electronic Materials Co., Ltd. had a meeting with Jintan Hualuogengao of Jiangsu Province on May 27, 2024arabicroulette...
Newsletter text
[Tongcheng Xincai: Subsidiaries sign cooperation agreement on "Semiconductor Chip Advanced Polishing Pad Project"] Securities Times e Company News, Tongcheng Xincai (603650) announced on the evening of May 27 that its wholly-owned subsidiary Shanghai Tongcheng Electronic Materials Co., Ltd. signed the "Cooperation Agreement on" Semiconductor Chip Advanced Polishing Pad Project "with the Management Committee of Jintan Hualuogeng High-tech Industrial Development Zone of Jiangsu Province on May 27, 2024. The investment registered in the agreement is 300 million yuan (the final investment amount is subject to the actual investment in the project construction). After the project successfully reaches production capacity, an annual output of 250,000 advanced polishing pads for semiconductor chips can be achieved, and the annual sales are expected to be approximately 800 million yuan after the completion period.
